Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2005)

High-temperature reliability of Flip Chip assemblies. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2006)

Lamination And Microstructuring Technology for a Bio-Cell Multiwell array - Erik Jung; Dionysios Manessis; Alexander Neumann 002; Lars Böttcher; Tanja Braun; Jörg Bauer 002; Herbert Reichl; Bruno Iafelice; Federica Destro; Roberto Gambari (CoRR, 2008)

Transport of moisture at epoxy-SiO2 interfaces investigated by molecular modeling. - O. Hölck; Jörg Bauer 002; Tanja Braun; Hans Walter; Olaf Wittler; Bernhard Wunderle; Klaus-Dieter Lang (Microelectron. Reliab., 2013)

From fan-out wafer to fan-out panel level packaging. - Tanja Braun; K.-F. Becker; S. Raatz; V. Bader; Jörg Bauer 002; Rolf Aschenbrenner; S. Voges; Tina Thomas; Ruben Kahle; Klaus-Dieter Lang (ECCTD, 2015)

Challenges for Miniaturised Energy Harvesting Sensor Systems. - Cristina Rusu; Sebastian Bader 002; Bengt Oelmann; Atila Alvandpour; Peter Enoksson; Tanja Braun; S. Tiedke; R. Dal Molin; G. Férin; P. Torvinen; Jessica Liljeholm (ICAIT, 2018)