Electrical modeling of Through Silicon and Package Vias. - Tapobrata Bandyopadhyay; Ritwik Chatterjee; Daehyun Chung; Madhavan Swaminathan; Rao R. Tummala (3DIC, 2009)

Trend from ICs to 3D ICs to 3D systems. - Rao R. Tummala; Venky Sundaram; Ritwik Chatterjee; P. Markodeya Raj; Nitesh Kumbhat; Vijay Sukumaran; Vikay Sridharan; Abhishek Choudury; Qiao Chen; Tapobrata Bandyopadhyay (CICC, 2009)