A 3D-Stacked SRAM using Inductive Coupling with Low-Voltage Transmitter and 12: 1 SerDes. - Kota Shiba; Tatsuo Omori; Kodai Ueyoshi; Kota Ando; Kazutoshi Hirose; Shinya Takamaeda-Yamazaki; Masato Motomura; Mototsugu Hamada; Tadahiro Kuroda (ISCAS, 2020)

Sub-10-μm Coil Design for Multi-Hop Inductive Coupling Interface. - Tatsuo Omori; Kota Shiba; Mototsugu Hamada; Tadahiro Kuroda (ASP-DAC, 2021)

A 3D-Stacked SRAM Using Inductive Coupling Technology for AI Inference Accelerator in 40-nm CMOS. - Kota Shiba; Tatsuo Omori; Mototsugu Hamada; Tadahiro Kuroda (ASP-DAC, 2021)

A 96-MB 3D-Stacked SRAM Using Inductive Coupling With 0.4-V Transmitter, Termination Scheme and 12: 1 SerDes in 40-nm CMOS. - Kota Shiba; Tatsuo Omori; Kodai Ueyoshi; Shinya Takamaeda-Yamazaki; Masato Motomura; Mototsugu Hamada; Tadahiro Kuroda (IEEE Trans. Circuits Syst. I Regul. Pap., 2021)