An inverse problem for a layered elastic plate. - Vladimir G. Romanov; Cheng-I Weng; Tei-Chen Chen (Appl. Math. Comput., 2003)

Investigation of electromigration reliability of redistribution lines in wafer-level chip-scale packages. - Chin-Li Kao; Tei-Chen Chen; Yi-Shao Lai; Ying-Ta Chiu (Microelectron. Reliab., 2014)

Thermal resistance of side by side multi-chip package: Thermal mode analysis. - Dao-Long Chen; Tei-Chen Chen; Ping-Feng Yang; Yi-Shao Lai (Microelectron. Reliab., 2015)

Ball impact responses of Sn-1Ag-0.5Cu solder joints at different temperatures and surface finishes. - Chin-Li Kao; Tei-Chen Chen (Microelectron. Reliab., 2018)