3D-Integrated Multichip Module Transceiver for Terabit-Scale DWDM Interconnects. - Stuart Daudlin; Anthony Rizzo; Nathan C. Abrams; Sunwoo Lee 002; Devesh Khilwani; Vaishnavi Murthy; James Robinson; Terence Collier; Alyosha C. Molnar; Keren Bergman (OFC, 2021)