High-efficiency wireless power transfer for mm-size biomedical implants. - Thibault P. Delhaye; Nicolas André; Samuel Gilet; Cecilia Gimeno; Laurent A. Francis; Denis Flandre (IEEE SENSORS, 2017)

Anisotropic conductive film & flip-chip bonding for low-cost sensor prototyping on rigid & flex PCB. - Serguei Stoukatch; Nicolas André; Thibault P. Delhaye; François Dupont; Jean-Michel Redouté; Denis Flandre (IEEE SENSORS, 2020)

Improving MOSFET Piezoresistive Strain Gauges Limit of Detection Using Lock-In Principle. - Thibault P. Delhaye; Nicolas Roisin; Nicolas André; Laurent A. Francis; Denis Flandre (IEEE SENSORS, 2021)

The Environmental Footprint of IC Production: Meta-Analysis and Historical Trends. - Thibault Pirson; Thibault P. Delhaye; Alex Pip; Grégoire Le Brun; Jean-Pierre Raskin; David Bol (ESSDERC, 2022)

The environmental footprint of integrated circuits (IC): supporting a review with data. - Thibault Pirson; Thibault P. Delhaye; Alex Pip; Grégoire Le Brun (IEEE DataPort, 2022)