Low-temperature low-cost 58 Bismuth - 42 Tin alloy forensic chip re-balling and re-soldering. - Thibaut Heckmann; Thomas R. Souvignet; S. Lepeer; David Naccache (Digit. Investig., 2016)

Electrically conductive adhesives, thermally conductive adhesives and UV adhesives in data extraction forensics. - Thibaut Heckmann; Thomas R. Souvignet; David Naccache (Digit. Investig., 2017)

Forensic smartphone analysis using adhesives: Transplantation of Package on Package components. - Thibaut Heckmann; Konstantinos Markantonakis; David Naccache; Thomas R. Souvignet (Digit. Investig., 2018)

Reverse engineering secure systems using physical attacks. (Rétro-conception de systèmes sécurisés par attaques physiques). - Thibaut Heckmann (2018)

Removing epoxy underfill between neighbouring components using acid for component chip-off. - Thibaut Heckmann; James P. McEvoy; Konstantinos Markantonakis; Raja Naeem Akram; David Naccache (Digit. Investig., 2019)

Decrease of energy deposited during laser decapsulation attacks by dyeing and pigmenting the ECA: Application to the forensic micro-repair of wire bonding. - Thibaut Heckmann; Thomas R. Souvignet; David Naccache (Digit. Investig., 2019)

From Lucky Luke to Lock Bits. - Thomas R. Souvignet; Thibaut Heckmann; Timothy Bollé (IEEE Secur. Priv., 2020)

Physical fault injection and side-channel attacks on mobile devices: A comprehensive analysis. - Carlton Shepherd; Konstantinos Markantonakis; Nico van Heijningen; Driss Aboulkassimi; Clément Gaine; Thibaut Heckmann; David Naccache (Comput. Secur., 2021)

Physical Fault Injection and Side-Channel Attacks on Mobile Devices: A Comprehensive Survey. - Carlton Shepherd; Konstantinos Markantonakis; Nico van Heijningen; Driss Aboulkassimi; Clément Gaine; Thibaut Heckmann; David Naccache (CoRR, 2021)

Medical Equipment Used for Forensic Data Extraction: A low-cost solution for forensic laboratories not provided with expensive diagnostic or advanced repair equipment. - Thibaut Heckmann; Thomas R. Souvignet; Damien Sauveron; David Naccache (Digit. Investig., 2021)

New Diagnostic Forensic Protocol for Damaged Secure Digital Memory Cards. - Fabien Thomas-Brans; Thibaut Heckmann; Konstantinos Markantonakis; Damien Sauveron (IEEE Access, 2022)

A forensic analysis of the Google Home: repairing compressed data without error correction. - Hadrien Barral; Georges-Axel Jaloyan; Fabien Thomas-Brans; Matthieu Regnery; Rémi Géraud-Stewart; Thibaut Heckmann; Thomas R. Souvignet; David Naccache (Digit. Investig., 2022)

Swarms of Thermal and Optical Drones for Searching for Missing Persons. - Thibaut Heckmann; Gautier Filardo (AI4GS, 2024)

Case of study for in situ memory reading on damaged MultiMedia Card. - Fabien Thomas-Brans; Aya Fukami; Q. Clement; Thibaut Heckmann; Damien Sauveron (Forensic Sci. Int. Digit. Investig., 2024)