3D advanced integration technology for heterogeneous systems. - Pascal Vivet; Christian Bernard; Fabien Clermidy; Denis Dutoit; Eric Guthmuller; Ivan Miro Panades; Gaël Pillonnet; Yvain Thonnart; Arnaud Garnier; Didier Lattard; Amandine Jouve; Franck Bana; et al. (3DIC, 2015)

In-situ X-ray μLaue diffraction study of copper through-silicon vias. - Dario Ferreira Sanchez; Shay Reboh; Monica Larissa Djomeni Weleguela; Jean-Sébastien Micha; Odile Robach; Thierry Mourier; Patrice Gergaud; Pierre Bleuet (Microelectron. Reliab., 2016)