Thermal challenges for heterogeneous 3D ICs and opportunities for air gap thermal isolation. - Yang Zhang; Thomas E. Sarvey; Muhannad S. Bakir (3DIC, 2014)

Au-NiW Mechanically Flexible Interconnects (MFIs) and TSV integration for 3D interconnects. - Chaoqi Zhang 001; Paragkumar Thadesar; Muneeb Zia; Thomas E. Sarvey; Muhannad S. Bakir (3DIC, 2014)

Embedded cooling technologies for densely integrated electronic systems. - Thomas E. Sarvey; Yang Zhang; Li Zheng; Paragkumar Thadesar; Ravi Gutala; Colman Cheung; Arifur Rahman; Muhannad S. Bakir (CICC, 2015)

The impact of 3D stacking on GPU-accelerated deep neural networks: An experimental study. - William Wahby; Thomas E. Sarvey; Hardik Sharma; Hadi Esmaeilzadeh; Muhannad S. Bakir (3DIC, 2016)