First- and second-level packaging for the IBM eServer z900. - Hubert Harrer; Harald Pross; Thomas-Michael Winkel; Wiren Dale Becker; Herb I. Stoller; Masakazu Yamamoto; Shinji Abe; Bruce J. Chamberlin; George A. Katopis (IBM J. Res. Dev., 2002)

First- and second-level packaging of the z990 processor cage. - Thomas-Michael Winkel; Wiren Dale Becker; Hubert Harrer; Harald Pross; Dierk Kaller; Bernd Garben; Bruce J. Chamberlin; Scott A. Kuppinger (IBM J. Res. Dev., 2004)

High-speed interconnect and packaging design of the IBM System z9 processor cage. - Hubert Harrer; Daniel M. Dreps; Thomas-Michael Winkel; Wolfgang Scholz; Bao G. Truong; Andreas Huber; Tingdong Zhou; Kenneth L. Christian; Gary F. Goth (IBM J. Res. Dev., 2007)

Packaging design challenges of the IBM System z10 Enterprise Class server. - Thomas-Michael Winkel; Hubert Harrer; Dierk Kaller; Jochen Supper; Daniel M. Dreps; Kenneth L. Christian; D. Cosmadelis; Tingdong Zhou; Thomas Strach; J. Ludwig; David L. Edwards (IBM J. Res. Dev., 2009)

Electronic packaging of the IBM System z196 enterprise-class server processor cage. - Thomas Strach; Frank E. Bosco; Kenneth L. Christian; Kevin R. Covi; Martin Eckert; Gregory R. Edlund; Roland Frech; Hubert Harrer; Andreas Huber; Dierk Kaller; Martin Kindscher; A. Z. Muszynski; et al. (IBM J. Res. Dev., 2012)