An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. - Léa Di Cioccio; Pierric Gueguen; Rachid Taibi; Thomas Signamarcheix; Laurent Bally; Laurent Vandroux; Marc Zussy; Sophie Verrun; Jérôme Dechamp; Patrick Leduc; Myriam Assous; David Bouchu; et al. (3DIC, 2009)

First integration of Cu TSV using die-to-wafer direct bonding and planarization. - Patrick Leduc; Myriam Assous; Léa Di Cioccio; Marc Zussy; Thomas Signamarcheix; Antonio Roman; Maxime Rousseau; Sophie Verrun; Laurent Bally; David Bouchu; Lionel Cadix; Alexis Farcy; et al. (3DIC, 2009)

Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. - Ionut Radu; Didier Landru; Gweltaz Gaudin; Gregory Riou; Catherine Tempesta; Fabrice Letertre; Léa Di Cioccio; Pierric Gueguen; Thomas Signamarcheix; C. Euvrard; Jérôme Dechamp; Laurent Clavelier; et al. (3DIC, 2010)

200°C direct bonding copper interconnects : Electrical results and reliability. - Léa Di Cioccio; Rachid Taibi; Cédrick Chappaz; Stéphane Moreau; Laurent-Luc Chapelon; Thomas Signamarcheix (3DIC, 2011)

Deep-amorphization and solid-phase epitaxial regrowth processes for hybrid orientation technologies in SOI MOSFETs with thin body. - Akiko Ohata; Young-Ho Bae; Sorin Cristoloveanu; Thomas Signamarcheix; J. Widiez; Bruno Ghyselen; Olivier Faynot; Laurent Clavelier (Microelectron. Reliab., 2012)

Chip to wafer copper direct bonding electrical characterization and thermal cycling. - Yann Beilliard; Perceval Coudrain; Léa Di Cioccio; Stéphane Moreau; Loic Sanchez; Brigitte Montmayeul; Thomas Signamarcheix; Rafael Estevez; Guillaume Parry (3DIC, 2013)

Novel low temperature 3D wafer stacking technology for high density device integration. - Ionut Radu; Gweltaz Gaudin; William van den Daele; Fabrice Letertre; Carlos Mazure; Léa Di Cioccio; Thomas Lacave; Frederic Mazen; Pascal Scheiblin; Thomas Signamarcheix; Sorin Cristoloveanu (ESSDERC, 2013)

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding. - Yann Beilliard; Stéphane Moreau; Léa Di Cioccio; Perceval Coudrain; G. Romano; A. Nowodzinski; F. Aussenac; P.-H. Jouneau; E. Rolland; Thomas Signamarcheix (3DIC, 2014)

Overcoming the Data Deluge Challenges with Greener Electronics. - Jean-René Léquepeys; Marc Duranton; Susana Bonnetier; Sandrine Catrou; Richard Fournel; Thomas Ernst 005; Laurent Hérault; D. Louis; A. Jerraya; Alexandre Valentian; François Perruchot; Thomas Signamarcheix; et al. (ESSDERC, 2021)