Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects. - Joeri De Vos; Lan Peng; Alain Phommahaxay; Joost Van Ongeval; Andy Miller; Eric Beyne; Florian Kurz; Thomas Wagenleiter; Markus Wimplinger; Thomas Uhrmann (3DIC, 2016)