Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach. - Thomas Wlanis; René Hammer; Werner Ecker; Sandrine Lhostis; Clément Sart; Sébastien Gallois-Garreignot; Bernhard Rebhan; Günther A. Maier (Microelectron. Reliab., 2018)