Electrothermal simulation of bonding wire degradation under uncertain geometries. - Thorben Casper; Herbert De Gersem; Renaud Gillon; Tomás Gotthans; Tomas Kratochvil; Peter Meuris; Sebastian Schöps (DATE, 2016)

Automatic Generation of Equivalent Electrothermal SPICE Netlists from 3D Electrothermal Field Models. - Thorben Casper; Herbert De Gersem; Sebastian Schöps (CoRR, 2016)

Determination of Bond Wire Failure Probabilities in Microelectronic Packages. - Thorben Casper; Ulrich Römer; Sebastian Schöps (CoRR, 2016)

High Dimensional Uncertainty Quantification for an Electrothermal Field Problem using Stochastic Collocation on Sparse Grids and Tensor Train Decomposition. - Dimitrios Loukrezis; Ulrich Römer; Thorben Casper; Sebastian Schöps; Herbert De Gersem (CoRR, 2016)

Increasing EM Robustness of Placement and Routing Solutions based on Layout-Driven Discretization. - Steve Bigalke; Jens Lienig; Thorben Casper; Sebastian Schöps (PRIME, 2018)

Automated Netlist Generation for 3D Electrothermal and Electromagnetic Field Problems. - Thorben Casper; David Duque; Sebastian Schöps; Herbert De Gersem (CoRR, 2018)

Proper Generalized Decomposition of Parameterized Electrothermal Problems Discretized by the Finite Integration Technique. - Alexander Krimm; Thorben Casper; Sebastian Schöps; Herbert De Gersem; Ludovic Chamoin (CoRR, 2018)

3D Field Simulation Model for Bond Wire On-Chip Inductors Validated by Measurements. - Katrin Hirmer; Thorben Casper; Sebastian Schöps; Klaus Hofmann (CoRR, 2019)

Coupled simulation of transient heat flow and electric currents in thin wires: Application to bond wires in microelectronic chip packaging. - Thorben Casper; Ulrich Römer; Herbert De Gersem; Sebastian Schöps (Comput. Math. Appl., 2020)