Advanced wafer bonding solutions for TSV integration with thin wafers. - Bioh Kim; Thorsten Matthias; Markus Wimplinger; Paul Lindner (3DIC, 2009)

Recent progress in thin wafer processing. - Thomas Uhrmann; Thorsten Matthias; Markus Wimplinger; Jurgen Burggraf; Daniel Burgstaller; Harald Wiesbauer; Paul Lindner (3DIC, 2013)

Numerical analysis of draw bending of load-adapted sheet metal profiles. - Bernd-Arno Behrens; Anas Bouguecha; J. Rosenberger; Thorsten Matthias (Prod. Eng., 2013)