8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO. - Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Chia-Pin Chiu; Arnab Sarkar 004; Asako Toda; Yanjing Ke; Allen Chan; Daniel Jeong; Mason Zhang; Sangeeta Raman; Thungoc Tran; et al. (OFC, 2021)

5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O. - Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Daniel Jeong; Allen Chan; Austin Katzin; Songtao Liu; Radek Roucka; Manan Raval; Minh Mac; Chia-Pin Chiu; Thungoc Tran; et al. (VLSI Technology and Circuits, 2022)

Arvon: A Heterogeneous SiP Integrating a 14nm FPGA and Two 22nm 1.8TFLOPS/W DSPs with 1.7Tbps/mm2 AIB 2.0 Interface to Provide Versatile Workload Acceleration. - Wei Tang 010; Sung-Gun Cho; Tim Tri Hoang; Jacob Botimer; Wei Qiang Zhu; Ching-Chi Chang; Cheng-Hsun Lu; Junkang Zhu; Yaoyu Tao; Tianyu Wei; Naomi Kavi Motwani; Mani Yalamanchi; et al. (VLSI Technology and Circuits, 2023)

Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration. - Wei Tang 010; Sung-Gun Cho; Tim Tri Hoang; Jacob Botimer; Wei Qiang Zhu; Ching-Chi Chang; Cheng-Hsun Lu; Junkang Zhu; Yaoyu Tao; Tianyu Wei; Naomi Kavi Motwani; Mani Yalamanchi; et al. (IEEE J. Solid State Circuits, 2024)