FlexOS: making OS isolation flexible. - Hugo Lefeuvre; Vlad-Andrei Badoiu; Stefan Teodorescu; Pierre Olivier; Tiberiu Mosnoi; Razvan Deaconescu; Felipe Huici; Costin Raiciu (HotOS, 2021)

Depth-3 Circuits for Inner Product. - Mika Göös; Ziyi Guan; Tiberiu Mosnoi (Electron. Colloquium Comput. Complex., 2023)