Electrical field mapping in InGaP HEMTs and GaAs terahertz emitters using backside infrared OBIC technique. - Dionyz Pogany; Ján Kuzmík; J. Darmo; Martin Litzenberger; Sergey Bychikhin; Karl Unterrainer; Z. Mozolova; S. Hascik; Tibor Lalinsky; Erich Gornik (Microelectron. Reliab., 2002)

Micromechanical Thermal Converter Device Based On Polyimide-Fixed Island Structure. - Tibor Lalinsky; M. Krnac; S. Hascik; Z. Mozolova; L. Matay; I. Kostic; P. Hrkut; Jiri Jakovenko; Miroslav Husák (Int. J. Comput. Eng. Sci., 2003)

Design and simulation of micromechanical thermal converter for RF power sensor microsystem. - Jiri Jakovenko; Miroslav Husák; Tibor Lalinsky (Microelectron. Reliab., 2004)

Optimization and performance of Al2O3/GaN metal-oxide-semiconductor structures. - Karol Cico; Ján Kuzmík; Dagmar Gregusová; Roman Stoklas; Tibor Lalinsky; Alexandros G. Georgakilas; Dionyz Pogany; Karol Fröhlich (Microelectron. Reliab., 2007)