Compact and Broadband 300 GHz Three-Element on-chip Patch Antenna. - Tim Pfahler; Martin Vossiek; Jan Schur (RWS, 2023)

3D-Printed Dielectric Image Lines towards Chip-to-Chip Interconnects for subTHz-Applications. - Leonhard Hahn; Tim Pfahler; Tobias Bader; Gerald Gold; Martin Vossiek; Christian Carlowitz (CoRR, 2024)