TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth In-Package Optical I/O. - Mark T. Wade; Roy Meade; Chandru Ramamurthy; Michael Rust; Forrest Sedgwick; Vladimir Stojanovic; Derek Van Orden; Chong Zhang; Chen Sun 003; Sergey Y. Shumarayev; Conor O'Keeffe; Erik Anderson; et al. (IEEE Micro, 2020)

8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO. - Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Chia-Pin Chiu; Arnab Sarkar 004; Asako Toda; Yanjing Ke; Allen Chan; Daniel Jeong; Mason Zhang; Sangeeta Raman; Thungoc Tran; et al. (OFC, 2021)

5.12 Tbps Co-Packaged FPGA and Silicon Photonics Interconnect I/O. - Kaveh Hosseini; Edwin Kok; Sergey Y. Shumarayev; Daniel Jeong; Allen Chan; Austin Katzin; Songtao Liu; Radek Roucka; Manan Raval; Minh Mac; Chia-Pin Chiu; Thungoc Tran; et al. (VLSI Technology and Circuits, 2022)

Simultaneous Error-Free Data Modulation with Silicon Microdisks in the Multi-FSR Regime for Scalable DWDM Links. - Vignesh Gopal; Anthony Rizzo; Maarten Hattink; Asher Novick; James Robinson; Kaveh Hosseini; Tim Tri Hoang; Keren Bergman (OFC, 2023)

Arvon: A Heterogeneous SiP Integrating a 14nm FPGA and Two 22nm 1.8TFLOPS/W DSPs with 1.7Tbps/mm2 AIB 2.0 Interface to Provide Versatile Workload Acceleration. - Wei Tang 010; Sung-Gun Cho; Tim Tri Hoang; Jacob Botimer; Wei Qiang Zhu; Ching-Chi Chang; Cheng-Hsun Lu; Junkang Zhu; Yaoyu Tao; Tianyu Wei; Naomi Kavi Motwani; Mani Yalamanchi; et al. (VLSI Technology and Circuits, 2023)

Silicon Photonics Chip I/O for Ultra High-Bandwidth and Energy-Efficient Die-to-Die Connectivity. - Yuyang Wang 003; Songli Wang; Robert Parsons; Asher Novick; Vignesh Gopal; Kaylx Jang; Anthony Rizzo; Chia-Pin Chiu; Kaveh Hosseini; Tim Tri Hoang; Sergey Y. Shumarayev; Keren Bergman (CICC, 2024)

Automated Tuning of Ring-Assisted MZI-Based Interleaver for DWDM Systems. - Songli Wang; Yuyang Wang 003; Xiang Meng 003; Kaveh Hosseini; Tim Tri Hoang; Keren Bergman (OFC, 2024)

Arvon: A Heterogeneous System-in-Package Integrating FPGA and DSP Chiplets for Versatile Workload Acceleration. - Wei Tang 010; Sung-Gun Cho; Tim Tri Hoang; Jacob Botimer; Wei Qiang Zhu; Ching-Chi Chang; Cheng-Hsun Lu; Junkang Zhu; Yaoyu Tao; Tianyu Wei; Naomi Kavi Motwani; Mani Yalamanchi; et al. (IEEE J. Solid State Circuits, 2024)