Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines. - Chao-Kun Hu; Kenneth P. Rodbell; Timothy D. Sullivan; Kim Y. Lee; Dennis P. Bouldin (IBM J. Res. Dev., 1995)

IBM experiments in soft fails in computer electronics (1978-1994). - James F. Ziegler; Huntington W. Curtis; Hans P. Muhlfeld; Charles J. Montrose; B. Chin; Michael Nicewicz; C. A. Russell; Wen Y. Wang; Leo B. Freeman; P. Hosier; L. E. LaFave; James L. Walsh; et al. (IBM J. Res. Dev., 1996)

Early reliability assessment by using deep censoring. - Harry A. Schafft; Linda M. Head; Jason Gill; Timothy D. Sullivan (Microelectron. Reliab., 2003)

Reliability challenges for copper interconnects. - Baozhen Li; Timothy D. Sullivan; Tom C. Lee; Dinesh Badami (Microelectron. Reliab., 2004)

Application of three-parameter lognormal distribution in EM data analysis. - Baozhen Li; Emmanuel Yashchin; Cathryn Christiansen; Jason Gill; Ronald Filippi; Timothy D. Sullivan (Microelectron. Reliab., 2006)