Improving the FE simulation of molded packages using warpage measurements. - Saskia Huber; Marius van Dijk; Hans Walter; Olaf Wittler; Tina Thomas; Klaus-Dieter Lang (Microelectron. Reliab., 2014)

From fan-out wafer to fan-out panel level packaging. - Tanja Braun; K.-F. Becker; S. Raatz; V. Bader; Jörg Bauer 002; Rolf Aschenbrenner; S. Voges; Tina Thomas; Ruben Kahle; Klaus-Dieter Lang (ECCTD, 2015)