Effect of Cr additions on interfacial reaction between the Sn-Zn-Bi solder and Cu/electroplated Ni substrates. - Jinglin Bi; Anmin Hu; Jing Hu; Tingbi Luo; Ming Li; Dali Mao (Microelectron. Reliab., 2011)

Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder. - Tingbi Luo; Anmin Hu; Jing Hu; Ming Li; Dali Mao (Microelectron. Reliab., 2012)

Study on low-Ag content Sn-Ag-Zn/Cu solder joints. - Tingbi Luo; Zhuo Chen; Anmin Hu; Ming Li; Peng Li (Microelectron. Reliab., 2013)

Formation and growth of interfacial intermetallic layers of Sn-8Zn-3Bi-0.3Cr on Cu, Ni and Ni-W substrates. - Jiaxing Liang; Tingbi Luo; Anmin Hu; Ming Li (Microelectron. Reliab., 2014)