Void Formation and Their Effect on Reliability of Lead-Free Solder Joints on MID and PCB Substrates. - Paul Wild; Tobias Grözinger; Dominik Lorenz; André Zimmermann (IEEE Trans. Reliab., 2017)

Reliability Study and Thermal Performance of LEDs on Molded Interconnect Devices (MID) and PCB. - Mahdi Soltani; Moritz Freyburger; Romit Kulkarni; Rainer Mohr; Tobias Groezinger; André Zimmermann (IEEE Access, 2018)

Effect of Joule heating on the reliability of solder joints under power cycling conditions. - Jie Mei; R. Haug; O. Lanier; Tobias Grözinger; André Zimmermann (Microelectron. Reliab., 2018)

Effect of voids on thermo-mechanical reliability of chip resistor solder joints: Experiment, modelling and simulation. - Paul Wild; Dominik Lorenz; Tobias Grözinger; André Zimmermann (Microelectron. Reliab., 2018)

A Novel Approach for Reliability Investigation of LEDs on Molded Interconnect Devices Based on FE-Analysis Coupled to Injection Molding Simulation. - Mahdi Soltani; Romit Kulkarni; Tobias Scheinost; Tobias Groezinger; André Zimmermann (IEEE Access, 2019)

Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane. - Adrian Schwenck; Tobias Grözinger; Thomas Günther; Axel Schumacher; Dietmar Schuhmacher; Kai Werum; André Zimmermann (Sensors, 2021)