Intermetallic Compounds (IMCs) Growth Investigation, Kinetic Parameter Analysis and Reliability Evaluation of In Solder Metal for 3D Integration Packaging. - Tassawar Hussain; Jaber Derakhshandeh; Tom Cochet; Ehsan Shafahian; Prathamesh Dhakras; Aksel Göhnermeier; Eric Beyne; Ingrid De Wolf (IEEE J. Emerg. Sel. Topics Circuits Syst., 2025)