Package level interconnect options. - J. Balachandran; Steven Brebels; Geert Carchon; Tomas Webers; Walter De Raedt; Bart Nauwelaers; Eric Beyne (SLIP, 2005)

Analysis and modeling of power grid transmission lines. - J. Balachandran; Steven Brebels; Geert Carchon; Tomas Webers; Walter De Raedt; Bart Nauwelaers; Eric Beyne (DATE, 2006)

Active Electrode Arrays by Chip Embedding in a Flexible Silicone Carrier. - Mathieu Vanden Bulcke; Kris Baert; Eric Beyne; Mario Gonzalez; Christophe Winters; Tomas Webers (EMBC, 2006)

Die to wafer 3D stacking for below 10um pitch microbumps. - Jaber Derakhshandeh; Lin Hou; Inge De Preter; Carine Gerets; Samuel Suhard; Vikas Dubey; Geraldine Jamieson; Fumihiro Inoue; Tomas Webers; Pieter Bex; Giovanni Capuz; Eric Beyne; et al. (3DIC, 2016)

(Why do we need) Wireless Heterogeneous Integration (anyway?). - Michaël Peeters; S. Sinha; Xiao Sun; Claude Desset; Giuseppe Gramegna; John Slabbekoorn; Pieter Bex; Nelson Pinho; Tomas Webers; Dimitrios Velenis; Andy Miller; Nadine Collaert; et al. (VLSI Technology and Circuits, 2022)