Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. - Tomoji Nakamura; Hideki Kitada; Yoriko Mizushima; Nobuhide Maeda; Koji Fujimoto; Takayuki Ohba (3DIC, 2011)

Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. - Osamu Nakatsuka; Hideki Kitada; Young-Suk Kim; Yoriko Mizushima; Tomoji Nakamura; Takayuki Ohba; Shigeaki Zaima (3DIC, 2011)

Experimental and numerical evaluation of interfacial adhesion on Cu/SiN in LSI interconnect structures. - Masaki Omiya; Kozo Koiwa; Nobuyuki Shishido; Shoji Kamiya; Chuantong Chen; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (Microelectron. Reliab., 2013)

Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. - Yoriko Mizushima; Young-Suk Kim; Tomoji Nakamura; Shoichi Kodama; Nobuhide Maeda; Koji Fujimoto; Takayuki Ohba (3DIC, 2014)

Characterization of stress distribution in ultra-thinned DRAM wafer. - Tomoji Nakamura; Yoriko Mizushima; Young-Suk Kim; Ryuichi Sugie; Takayuki Ohba (3DIC, 2015)

Scenario for catastrophic failure in interconnect structures under chip package interaction. - Masaki Omiya; Shoji Kamiya; Nobuyuki Shishido; Kozo Koiwa; Hisashi Sato; Masahiro Nishida; Takashi Suzuki; Tomoji Nakamura; Toshiaki Suzuki; Takeshi Nokuo (IRPS, 2015)

Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy. - Norio Chujo; Koji Sakui; Shinji Sugatani; Hiroyuki Ryoson; Tomoji Nakamura; Takayuki Ohba (VLSI Technology and Circuits, 2023)