Thermal Analysis of Reflow Process for PIC-Embedded Package Substrate with 2.3D RDL Interposer for Co-Packaged Optics. - Akihiro Noriki; Hirotaka Uemura; Haruhiko Kuwatsuka; Naoki Matsui; Reona Motoji; Dan Maeda; Tomoya Sugita; Fumi Nakamura; Takeru Amano (3DIC, 2024)