Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly. - Yi-Shao Lai; Tong Hong Wang (Microelectron. Reliab., 2005)

Optimal design towards enhancement of board-level thermomechanical reliability of wafer-level chip-scale packages. - Yi-Shao Lai; Tong Hong Wang (Microelectron. Reliab., 2007)

Cyclic bending reliability of wafer-level chip-scale packages. - Yi-Shao Lai; Tong Hong Wang; Han-Hui Tsai; Ming-Hwa R. Jen (Microelectron. Reliab., 2007)

Structural characteristics of carbon nanostructures synthesized by ECR-CVD. - Te-Hua Fang; Tong Hong Wang; Deng-Maw Lu; Wen-Chieh Lien (Microelectron. J., 2008)

Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. - Tong Hong Wang; Yi-Shao Lai; Yu-Cheng Lin (Microelectron. Reliab., 2008)

Effect of surface roughness of silicon die and copper heat spreader on thermal performance of HFCBGA. - Tong Hong Wang; Sara N. Paisner; Chang-Chi Lee; Susan Chen; Yi-Shao Lai (Microelectron. Reliab., 2011)

Structural design guideline to minimize extreme low-k delamination potential in 40 nm flip-chip packages. - Yi-Shao Lai; Meng-Kai Shih; Chang-Chi Lee; Tong Hong Wang (Microelectron. Reliab., 2012)

Study of factors affecting warpage of HFCBGA subjected to reflow soldering-liked profile. - Tong Hong Wang; Ching-I Tsai; Chang-Chi Lee; Yi-Shao Lai (Microelectron. Reliab., 2013)