Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn. - Tong Yan Tee; Giovanni Frezza; Mayhuan Lim; Hun Shen Ng; Federico Ziglioli; Zhaowei Zhong (Int. J. Comput. Eng. Sci., 2003)

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill. - Tong Yan Tee; Chek Lim Kho; Daniel Yap; Carol Toh; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Xavier Baraton; Zhaowei Zhong (Microelectron. Reliab., 2003)

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages. - Tong Yan Tee; Hun Shen Ng; Daniel Yap; Zhaowei Zhong (Microelectron. Reliab., 2003)

Impact life prediction modeling of TFBGA packages under board level drop test. - Tong Yan Tee; Hun Shen Ng; Chwee Teck Lim; Eric Pek; Zhaowei Zhong (Microelectron. Reliab., 2004)

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis. - Tong Yan Tee; Zhaowei Zhong (Microelectron. Reliab., 2004)

Board level solder joint reliability analysis and optimization of pyramidal stacked die BGA packages. - Tong Yan Tee; Zhaowei Zhong (Microelectron. Reliab., 2004)

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. - Tong Yan Tee; Hun Shen Ng; Zhaowei Zhong (Microelectron. Reliab., 2006)

Dynamic responses and solder joint reliability under board level drop test. - Jing-en Luan; Tong Yan Tee; Eric Pek; Chwee Teck Lim; Zhaowei Zhong (Microelectron. Reliab., 2007)

Advanced analysis on board trace reliability of WLCSP under drop impact. - Ahmer Syed; Tong Yan Tee; Hun Shen Ng; Rex Anderson; Choong Peng Khoo; Boyd Rogers (Microelectron. Reliab., 2010)

Advances in Wafer Level Packaging (WLP). - Tong Yan Tee; Xuejun Fan; Yi-Shao Lai (Microelectron. Reliab., 2010)