The 3D Helical Keyboard. - Michael Cohen; Toshifumi Kanno (NIME, 2001)

Non-linear analyses of strain in flip chip packages improved by the measurement using the digital image correlation method. - Toru Ikeda; Toshifumi Kanno; Nobuyuki Shishido; Noriyuki Miyazaki; Hiroyuki Tanaka; Takuya Hatao (Microelectron. Reliab., 2013)