Development of wafer thinning and dicing technology for thin wafer. - Chuichi Miyazaki; Haruo Shimamoto; Toshihide Uematsu; Yoshiyuki Abe (3DIC, 2009)

Development of high accuracy wafer thinning and pickup technology for thin wafer. - Chuichi Miyazaki; Haruo Shimamoto; Toshihide Uematsu; Yoshiyuki Abe; Kosuke Kitaichi; Tadahiro Morifuji; Shoji Yasunaga (3DIC, 2010)