High density and reliable packaging technology with Non Conductive Film for 3D/TSV. - Kentaro Mori; Yoshihiro Ono; Shinji Watanabe 004; Toshikazu Ishikawa; Michiaki Sugiyama; Satoshi Imasu; Toshihiko Ochiai; Ryo Mori; Tsuyoshi Kida; Tomoaki Hashimoto; Hideki Tanaka; Michitaka Kimura (3DIC, 2013)

Testability improvement for 12.8 GB/s Wide IO DRAM controller by small area pre-bonding TSV tests and a 1 GHz sampled fully digital noise monitor. - Takao Nomura; Ryo Mori; Munehiro Ito; Koji Takayanagi; Toshihiko Ochiai; Kazuki Fukuoka; Kazuo Otsuga; Koji Nii; Sadayuki Morita; Tomoaki Hashimoto; Tsuyoshi Kida; Junichi Yamada; et al. (CICC, 2013)