Evaluation of hybrid bonding technology of single-micron pitch with planar structure for 3D interconnection. - Masaki Ohyama; Masatsugu Nimura; Jun Mizuno; Shuichi Shoji; Toshihisa Nonaka; Yoichi Shinba; Akitsu Shigetou (Microelectron. Reliab., 2016)

Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package. - Koji Hamaguchi; Mitsuki Nakata; Kouta Segawa; Naoya Suzuki; Toshihisa Nonaka (3DIC, 2019)