Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography. - Masanori Usui; Hidehiko Kimura; Toshikazu Satoh; Takashi Asada; Satoshi Yamaguchi; Masashi Kato (Microelectron. Reliab., 2016)

Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding. - Masanori Usui; Toshikazu Satoh; Hidehiko Kimura; S. Tajima; Y. Hayashi; Daigo Setoyama; Masashi Kato (Microelectron. Reliab., 2017)