High density 3D integration by pre-applied Inter Chip Fill. - Akihiro Horibe; Kuniaki Sueoka; Katsuyuki Sakuma; Sayuri Kohara; Keiji Matsumoto; Hidekazu Kikuchi; Yasumitsu Orii; Toshiro Mitsuhashi; Fumiaki Yamada (3DIC, 2010)