3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs. - Toufik Azoui; Patrick Tounsi; Philippe Dupuy; L. Guillot; Jean-Marie Dorkel (Microelectron. Reliab., 2011)

Innovative methodology to extract dynamic compact thermal models: Application to power devices. - Toufik Azoui; Patrick Tounsi; Jean-Marie Dorkel (Microelectron. J., 2012)

Estimation of power MOSFET junction temperature during avalanche mode: Experimental tests and modelling. - Toufik Azoui; Patrick Tounsi; Jean-Marie Dorkel; Jean-Michel Reynes; Jean-Luc Massol; E. Pomes (Microelectron. Reliab., 2013)