Fast filling of through-silicon via (TSV) with conductive polymer/metal composites. - Jin Kawakita; Barbara Horváth; Toyohiro Chikyow (3DIC, 2015)

Conductive polymer/metal composite for flexible interconnect. - Jin Kawakita; Toyohiro Chikyow (ICICDT, 2016)

Photoelectroscopic Study of Mn Barrier Layer on SiO2 for Si Wafer Bonding Process. - Takahiro Nagata; Kazumichi Tsumura; Kenro Nakamura; Kengo Uchida; Jin Kawakita; Toyohiro Chikyow; Kazuyuki Higashi (3DIC, 2019)

Evidence-based recommender system for high-entropy alloys. - Minh-Quyet Ha; Duong-Nguyen Nguyen; Viet Cuong Nguyen; Takahiro Nagata; Toyohiro Chikyow; Hiori Kino; Takashi Miyake; Thierry Denoeux; Van-Nam Huynh; Hieu-Chi Dam (Nat. Comput. Sci., 2021)