Impact of 3D copper TSV integration on 32SOI FEOL and BEOL reliability. - Mukta G. Farooq; Giuseppe La Rosa; Fen Chen; Prakash Periasamy; Troy L. Graves-abe; Chandrasekharan Kothandaraman; C. Collins; W. Landers; J. Oakley; J. Liu; John Safran; S. Ghosh; et al. (IRPS, 2015)

Three-Dimensional Dynamic Random Access Memories Using Through-Silicon-Vias. - Toshiaki Kirihata; John Golz; Matthew R. Wordeman; Pooja Batra; Gary W. Maier; Norman Robson; Troy L. Graves-abe; Daniel Berger; Subramanian S. Iyer (IEEE J. Emerg. Sel. Topics Circuits Syst., 2016)