6W/25mm2 inductive power transfer for non-contact wafer-level testing. - Andrzej Radecki; Hayun Chung; Yoichi Yoshida; Noriyuki Miura; Tsunaaki Shidei; Hiroki Ishikuro; Tadahiro Kuroda (ISSCC, 2011)

A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme. - Noriyuki Miura; Tsunaaki Shidei; Yuxiang Yuan; Shusuke Kawai; Keita Takatsu; Yuji Kiyota; Yuichi Asano; Tadahiro Kuroda (IEEE J. Solid State Circuits, 2011)

6 W/25 mm2 Wireless Power Transmission for Non-contact Wafer-Level Testing. - Andrzej Radecki; Hayun Chung; Yoichi Yoshida; Noriyuki Miura; Tsunaaki Shidei; Hiroki Ishikuro; Tadahiro Kuroda (IEICE Trans. Electron., 2012)

A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler. - Wataru Mizuhara; Tsunaaki Shidei; Atsutake Kosuge; Tsutomu Takeya; Noriyuki Miura; Masao Taguchi; Hiroki Ishikuro; Tadahiro Kuroda (ISSCC, 2013)

A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler. - Atsutake Kosuge; Wataru Mizuhara; Tsunaaki Shidei; Tsutomu Takeya; Noriyuki Miura; Masao Taguchi; Hiroki Ishikuro; Tadahiro Kuroda (IEEE J. Solid State Circuits, 2014)

Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory. - Atsutake Kosuge; Junki Hashiba; Toru Kawajiri; So Hasegawa; Tsunaaki Shidei; Hiroki Ishikuro; Tadahiro Kuroda; Ken Takeuchi (VLSIC, 2015)

An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories. - Atsutake Kosuge; Junki Hashiba; Toru Kawajiri; So Hasegawa; Tsunaaki Shidei; Hiroki Ishikuro; Tadahiro Kuroda; Ken Takeuchi (IEEE J. Solid State Circuits, 2016)

Real Chip Performance Evaluation on Through Chip Interface IP for Renesas SOTB 65nm Process. - Hideto Kayashima; Takuya Kojima; Hayate Okuhara; Tsunaaki Shidei; Hideharu Amano (CANDAR Workshops, 2019)