Influence of underfill materials on the reliability of coreless flip chip package. - Chun-Chih Chuang; Tsung-Fu Yang; Jin-Ye Juang; Yin-Po Hung; Chau-Jie Zhan; Yu-Min Lin; Ching-Tsung Lin; Pei-Chen Chang; Tao-Chih Chang (Microelectron. Reliab., 2008)