3D-IC BISR for stacked memories using cross-die spares. - Chun-Chuan Chi; Yung-Fa Chou; Ding-Ming Kwai; Yu-Ying Hsiao; Cheng-Wen Wu; Yu-Tsao Hsing; Li-Ming Denq; Tsung-Hsiang Lin (VLSI-DAT, 2012)