A neurofuzzy-based quality-control system for fine pitch stencil printing process in surface mount assembly. - Taho Yang; Tsung-Nan Tsai (J. Intell. Manuf., 2004)

A neural network-based prediction model for fine pitch stencil-printing quality in surface mount assembly. - Taho Yang; Tsung-Nan Tsai; Junwu Yeh (Eng. Appl. Artif. Intell., 2005)

Developing a multi-layer reference design retrieval technology for knowledge management in engineering design. - Yuh-Jen Chen; Yuh-Min Chen; Chin-Bin Wang; Hui-Chuan Chu; Tsung-Nan Tsai (Expert Syst. Appl., 2005)

Development of an integrated reflow soldering control system using incremental hybrid process knowledge. - Tsung-Nan Tsai (Expert Syst. Appl., 2005)

Neurofuzzy modelling of the reflow thermal profile for surface mount assembly. - Tsung-Nan Tsai; Taho Yang; Pao-An Hou (Int. J. Syst. Sci., 2005)

Modeling and optimization of stencil printing operations: A comparison study. - Tsung-Nan Tsai (Comput. Ind. Eng., 2008)

Selection of the optimum promotion mix by integrating a fuzzy linguistic decision model with genetic algorithms. - Tsuen-Ho Hsu; Tsung-Nan Tsai; Pei-Ling Chiang (Inf. Sci., 2009)

Thermal parameters optimization of a reflow soldering profile in printed circuit board assembly: A comparative study. - Tsung-Nan Tsai (Appl. Soft Comput., 2012)

Development of a soldering quality classifier system using a hybrid data mining approach. - Tsung-Nan Tsai (Expert Syst. Appl., 2012)

An adaptive diagnosis system for copper wire bonding process control and quality assessment in integrated circuit assembly. - Tsung-Nan Tsai (Int. J. Comput. Integr. Manuf., 2013)

Selection of the optimal configuration for a flexible surface mount assembly system based on the interrelationships among the flexibility elements. - Tsung-Nan Tsai (Comput. Ind. Eng., 2014)

Capturing customer judgments of product category. - Tsuen-Ho Hsu; Tsung-Nan Tsai; Yi-Jung Hung (Inf. Sci., 2014)

A hybrid intelligent approach for optimizing the fine-pitch copper wire bonding process with multiple quality characteristics in IC assembly. - Tsung-Nan Tsai (J. Intell. Manuf., 2014)

Optimizing the fine-pitch copper wire bonding process with multiple quality characteristics using a grey-fuzzy Taguchi method. - Jun-Hsien Yeh; Tsung-Nan Tsai (Microelectron. Reliab., 2014)

Identification and risk assessment of soldering failure sources using a hybrid failure mode and effect analysis model and a fuzzy inference system. - Tsung-Nan Tsai; Jun-Hsien Yeh (J. Intell. Fuzzy Syst., 2015)

Robust parameter design for the micro-BGA stencil printing process using a fuzzy logic-based Taguchi method. - Tsung-Nan Tsai; Mika Liukkonen (Appl. Soft Comput., 2016)