10.3 heterogeneous multi-processing quad-core CPU and dual-GPU design for optimal performance, power, and thermal tradeoffs in a 28nm mobile application processor. - Alice Wang; Tsung-Yao Lin; Shichin Ouyang; Wei-Hung Huang; Jidong Wang; Shu-Hsin Chang; Sheng-Ping Chen; Chun-Hsiung Hu; J. C. Tai; Koan-Sin Tan; Meng-Nan Tsou; Ming-Hsien Lee; et al. (ISSCC, 2014)

Helio X20: The first tri-gear mobile SoC with CorePilot™ 3.0 technology. - Tsung-Yao Lin; Ming-Hsien Lee; Loda Chou; Clavin Peng; Jih-Ming Hsu; Jia-Ming Chen; John-CC Chen; Alex Chiou; Artis Chiu; David Lee; Carrie Huang; Kenny Lee; et al. (Hot Chips Symposium, 2016)

Developing a Model to Explore Consumer Buying Behaviors through Long Short-Term Memory. - Yueh-Shiu Lee; I-Yun Chen; Tsung-Yao Lin; Yen-Chiao Chuang; Hsu-Jung Liu (ICEA, 2020)

7.1 A 3.4-to-13.3TOPS/W 3.6TOPS Dual-Core Deep-Learning Accelerator for Versatile AI Applications in 7nm 5G Smartphone SoC. - Chien-Hung Lin; Chih-Chung Cheng; Yi-Min Tsai; Sheng-Je Hung; Yu-Ting Kuo; Perry H. Wang; Pei-Kuei Tsung; Jeng-Yun Hsu; Wei-Chih Lai; Chia-Hung Liu; Shao-Yu Wang; Chin-Hua Kuo; et al. (ISSCC, 2020)

A 12-nm 0.62-1.61 mW Ultra-Low Power Digital CIM-based Deep-Learning System for End-to-End Always-on Vision. - En-Jui Chang; Cheng-Xin Xue; Chetan Deshpande; Gajanan Jedhe; Jenwei Liang; Chih-Chung Cheng; Hung-Wei Lin; Chia-Da Lee; Sushil Kumar; Kim Soon Jway; Zijie Guo; Ritesh Garg; et al. (VLSI Technology and Circuits, 2023)

20.1 NVE: A 3nm 23.2TOPS/W 12b-Digital-CIM-Based Neural Engine for High-Resolution Visual-Quality Enhancement on Smart Devices. - Ming-En Shih; Shih-Wei Hsieh; Ping-Yuan Tsai; Ming-Hung Lin; Pei-Kuei Tsung; En-Jui Chang; Jenwei Liang; Shu-Hsin Chang; Chung-Lun Huang; You-Yu Nian; Zhe Wan; Sushil Kumar; et al. (ISSCC, 2024)

A Quad-Core AI Processing Unit for Generative AI in 4nm 5G Smartphone SoC. - Chien-Hung Lin; Jeng-Yun Hsu; Cheng-Ying Yu; Chia-Wei Hsu; Yi-Min Tsai; Kuo-Sheng Wu; Chung-Lun Huang; Meng-Han Hsieh; Tsung-Yao Lin (VLSI Technology and Circuits, 2024)