Response spectra analysis for undamped structural systems subjected to half-sine impact acceleration pulses. - Tsung-Yueh Tsai; Chang-Lin Yeh; Yi-Shao Lai; Rong-Sheng Chen (Microelectron. Reliab., 2007)

Transient analysis of drop responses of board-level electronic packages using response spectra incorporated with modal superposition. - Chang-Lin Yeh; Tsung-Yueh Tsai; Yi-Shao Lai (Microelectron. Reliab., 2007)

Structural design optimization for board-level drop reliability of wafer-level chip-scale packages. - Tsung-Yueh Tsai; Yi-Shao Lai; Chang-Lin Yeh; Rong-Sheng Chen (Microelectron. Reliab., 2008)

High strain rate compression behavior for Sn-37Pb eutectic alloy, lead-free Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu alloys. - S. T. Jenq; Hsuan-Hu Chang; Yi-Shao Lai; Tsung-Yueh Tsai (Microelectron. Reliab., 2009)

Early experience with in situ chip-to-chip alignment characterization of Proximity Communication flip-chip package. - Theresa Sze; Darko Popovic; Jing Shi; Yi-Shao Lai; James G. Mitchell; Bruce Guenin; Tsung-Yueh Tsai; Chin-Li Kao; Matthew Giere (Microelectron. Reliab., 2010)