Routability-driven bump assignment for chip-package co-design. - Meng-Ling Chen; Tu-Hsiung Tsai; Hung-Ming Chen; Shi-Hao Chen (ASP-DAC, 2014)

Cost-effective decap selection for beyond die power integrity. - Yi-En Chen; Tu-Hsiung Tsai; Shi-Hao Chen; Hung-Ming Chen (DATE, 2014)