Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact. - Chan-Yen Chou; Tuan-Yu Hung; Shin-Yueh Yang; Ming-Chih Yew; Wen-Kun Yang; Kuo-Ning Chiang (Microelectron. Reliab., 2008)

Light degradation test and design of thermal performance for high-power light-emitting diodes. - Yen-Fu Su; Shin-Yueh Yang; Tuan-Yu Hung; Chang-Chun Lee; Kuo-Ning Chiang (Microelectron. Reliab., 2012)