11.1 AMD InstinctTM MI300 Series Modular Chiplet Package - HPC and AI Accelerator for Exa-Class Systems. - Alan Smith; Eric Chapman; Chintan Patel; Raja Swaminathan; John J. Wuu; Tyrone Huang; Wonjun Jung; Alexander Kaganov; Hugh McIntyre; Ramon Mangaser (ISSCC, 2024)

AMD Instinct™ MI300X Accelerator: Packaging and Architecture Co-Optimization. - Alan Smith 003; Gabriel H. Loh; John J. Wuu; Samuel Naffziger; Tyrone Huang; Hugh McIntyre; Ramon Mangaser; Wonjun Jung; Raja Swaminathan (VLSI Technology and Circuits, 2024)

Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator. - Alan Smith 003; Gabriel H. Loh; Samuel Naffziger; John J. Wuu; Nathan Kalyanasundharam; Eric Chapman; Raja Swaminathan; Tyrone Huang; Wonjun Jung; Alexander Kaganov; Hugh McIntyre; Ramon Mangaser (IEEE Micro, 2025)