Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load. - Tz-Cheng Chiu; Jyun-Ji Lin; Hung-Chun Yang; Vikas Gupta (Microelectron. Reliab., 2010)

Warpage evolution of overmolded ball grid array package during post-mold curing thermal process. - Tz-Cheng Chiu; Hong-Wei Huang; Yi-Shao Lai (Microelectron. Reliab., 2011)

A numerical procedure for simulating delamination growth on interfaces of interconnect structures. - Tz-Cheng Chiu; Chun-Hui Chen (Microelectron. Reliab., 2012)

Time-domain viscoelastic constitutive model based on concurrent fitting of frequency-domain characteristics. - Tz-Cheng Chiu; Bo-Sheng Lee; Dong-Yi Huang; Yu-Ting Yang; Yi-Hsiu Tseng (Microelectron. Reliab., 2015)

Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging. - Tz-Cheng Chiu; En-Yu Yeh (Microelectron. Reliab., 2018)