Effect of polyimide baking on bump resistance in flip-chip solder joints. - Hsi-Kuei Cheng; Shien-Ping Feng; Yi-Jen Lai; Kuo-Chio Liu; Ying-Lang Wang; Tzeng-Feng Liu; Chih-Ming Chen 002 (Microelectron. Reliab., 2014)

Online Product Recommendations based on Diversity and Latent Association Analysis on News and Products. - Hsing-Yu Chen; Yu-Chun Lin; Duen-Ren Liu; Tzeng-Feng Liu (J. Inf. Sci. Eng., 2022)